Bond Parameters
| Parameter | Bond 1 | Bond 2 |
| Ultrasonic (US) | 350 | 350 |
| Time (ms) | 400 | 400 |
| Force (mN) | 450 | 450 |
| Heat (ºC) | 120 | 120 |
Default ball bond parameters for 1 mil (25 μm) gold wire are outlined above. Adjustment (i.e. ±25, ±50) may be required to achieve successful bonds.
NOTE: Successful bond parameters may vary significantly depending on wire/pad materials, surface contamination/oxidation, thermal contact with heated stage, etc.