Wire Bonding Recipes

Bond Parameters

Parameter Bond 1 Bond 2
Ultrasonic (US) 350 350
Time (ms) 400 400
Force (mN) 450 450
Heat (ºC) 120 120

Default ball bond parameters for 1 mil (25 μm) gold wire are outlined above. Adjustment (i.e. ±25, ±50) may be required to achieve successful bonds.

NOTE: Successful bond parameters may vary significantly depending on wire/pad materials, surface contamination/oxidation, thermal contact with heated stage, etc.