Photolithography

Suss MicroTec MA6/MA4 Mask Aligners

The MA6 and MA4 Mask Aligners use UV light to transfer patterns from photomasks onto substrates coated with photoresist.

  • Exposure Resolution: < 1 ┬Ám
  • Alignment accuracy: Topside – 500nm
  • Exposure modes: Hard contact, soft contact, proximity, flood
  • Spectral range: 365nm – 405nm
  • Substrate accommodation: 1cm2 pieces and wafers up to 4″(MA4) or 6″ (MA6)
  • Uniformity: +- 5% over exposure area
  • CCD camera and monitor for image capture

Photolithography Wetbench

The Pratt Microfabrication Facility hosts a photolithography wet processing station dedicated to substrate cleaning, photoresist spin coating, curing, development and removal.

  • Provides a class 10 (ISO Class 4) working environment
  • Segregated wetbench stations and resist spinners for positive tone & negative tone resist preparation
  • Multiple hotplates available with manual control
  • Includes DI water, nitrogen gas utilities and all necessary chemical supplies for photoresist preparation