Metal Sputtering (DC Power)
| Material | Default Gun # | Pressure (mTorr) | Gas flow (sccm) | DC Power (W) | Sputter rate (Å/s) |
| Ni | 1 | 3 | 30 Ar | 200 | 1.8 |
| Cu | 1 | 3 | 30 Ar | 200 | 3.1 |
| Ti | 2 | 3 | 30 Ar | 200 | 0.8 |
| Al | 2 | 3 | 30 Ar | 200 | 1.1 |
| Cr | 2 | 3 | 30 Ar | 200 | 1.5 |
| W | 5 | 3 | 30 Ar | 200 | 0.8 |
| Ta | 5 | 3 | 30 Ar | 200 | 1.4 |
Dielectric Sputtering (RF Power)
| Material | Default Gun # | Pressure (mTorr) | Gas flow (sccm) | RF Power (W) | Sputter rate (Å/s) |
| Si | 3 | 3 | 30 Ar | 300 | 1.0 |
| SiO2 | 3 | 3 | 30 Ar | 300 | 0.7 |
| Si3N4 | 3 | 3 | 30 Ar | 150* | 0.22 |
| Al2O3 | 4 | 3 | 30 Ar | 250* | 0.16 |
| MgO | 4 | 3 | 30 Ar | 300 | 0.1 |
| ITO | 4 | 3 | 30 Ar | 50* | 0.3 |
*Maximum power permitted based on published maximum power density.