Sputter Depositon Recipes

Metal Sputtering (DC Power)

Material Default Gun # Vacuum (mTorr) Gas Flow (SCCM) Power (W) Sputter Rate (Å/s)
Ni 1 3 30 Ar 200 1.8
Cu 1 3 30 Ar 200 3.1
FeCo 1 3 30 Ar 200 1.1
Ti 2 3 30 Ar 200 0.8
Al 2 3 30 Ar 200 1.1
AlSi 2 3 30 Ar 200 1.1
C 2 3 30 Ar 250 0.16
Cr 2 3 30 Ar 200 1.5
W 5 3 30 Ar 200 0.8
Ta 5 3 30 Ar 200 1.4
Mo 5 3 30 Ar 200

Dielectric Sputtering (RF Power)

Material Default Gun # Vacuum (mTorr) Gas Flow (SCCM) Power (W) Sputter Rate (Å/s)
Si 3 3 30 Ar 300 1.0
SiO2 3 3 30 Ar 300 0.7
Si3N4 3 3 30 Ar 150 0.22
Al2O3 4 3 30 Ar 250 0.16
MgO 4 3 30 Ar 300 0.1
ITO 4 5 30 Ar 50 0.3